Sensors and Materials
Contents
 
 

Susumu Sugiyama
Ritsumeikan University, Japan
Research area: Microstructure fabrication using X-ray lithography, Micromachined semiconductor sensors, Microelectro-mechanical systems (MEMS)
 

Michael L. Reed
University of Virginia, US
Research area: Microsystems, Microfabrication, Nanotechnology

Juergen Wilde
University of Freiburg, Germany
Research area: Assembly and Packaging Technology

Kiyoshi Toko
Kyushu University, Japan
Research area: Bioelectronics, biosensors, taste sensor, electronic nose

Makoto Ishida
Toyohashi University of Technology, Japan
Research area: Image sensors, Smart sensors, MEMS

 

H. P. Baltes (Swiss Federal Institute of Technology)

O. Brand (Georgia Institute of Technology)

D. Cho (Seoul National University)

M. Esashi (Tohoku University)

B. Frazier (Georgia Institute of Technology)

K. Higuchi (NEC Corporation)

N. Ichinose (Waseda University)

M. Kimata (Mitsubishi Electric Corporation)

L. Landsberger (Concordia University)

G. Lim (Pohang University of Science and Technology)

Y. C. Lin (National Cheng Kung University)

I. Lundström (Linkoping University)

K. Najafi (University of Michigan)

H. Nanto (Kanazawa Institute of Technology)

A. Nathan (University of Waterloo)

M. Paranjape (Georgetown University)

N. de Rooij (Ecole Polytechnique Federale de Lausanne)

S. Roy (University of California, San Francisco)

Y. Shimizu (Nagasaki University)

I. G. Soncini (University of Trento)

O. Tabata (Kyoto University)

K. Toda (National Defense Academy)

Y. Wang (Shanghai Institute of Microsystem and Information Technology)

K. D. Wise (University of Michigan)

N. Yamazoe (Kyushu University)

K. Yoshino (Osaka University)

H. Zappe (University of Freiburg)




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